A wafer bonder joins two or several
wafers/substrates permanently or temporarily and
it needs different force, heat and current in
accordance with the process. We have developed
Focus series for optoelectronic devices
application, designed to be suitable for direct,
solder and adhesive bonding between
wafers/substrates at high temperature and
pressure. Heater is mounted on the top/bottom
side to minimize the warping of
wafers/substrates generated from different
thermal expansion coefficient. The bonding
process is possible under hydrogen atmosphere.
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